Hero Electronix’s Tessolve Acquires Dream Chip Technologies in ₹400 Crore Deal, Expanding European Chip Design Capabilities
Tessolve, a Hero Electronix venture, acquires Dream Chip Technologies for ₹400 crore, expanding in Europe and strengthening capabilities in AI, automotive, and data centers with turnkey chip design solutions.
Hero Electronix-owned semiconductor engineering firm Tessolve has agreed to acquire Dream Chip Technologies, the top European chip design companies. The deal valued at up to ₹400 crore (EUR 42.5 million) could place Tessolve at the forefront in advanced chip design solution provision in the world.
Dream Chip Technologies is based in Germany and specializes in digital chip design and the development of SoC technology for AI, automotive applications, data centers, and industrial uses. The buy will add custom chip designing capabilities to Tessolve through end-to-end design solutions for complex applications.
With this deal, Tessolve expands in Europe, adding four more delivery locations across Germany and the Netherlands, including its dedicated center for ADAS and imaging technologies. This way, Tessolve can deliver support to a larger clientele base as demand for customized chips in AI and automobile applications continues to grow further.
With Dream Chip having extensive capabilities in ASIC designs and expertise in digital chip solutions, it adds enormous muscle to our semiconductor engineering firm to serve the markets of Europe and grow chances for advanced chip solutions.
The acquisition is in line with Tessolve's mission of providing turnkey semiconductor solutions, that is design to volume production, speeding clients' "time to market" and seamless integration. Mr. Ujjwal Munjal, Chairman of Tessolve, added that synergy of Dream Chip with Tessolve would further accelerate the growth of custom chip development for Tessolve and push its global semiconductor market share.
Dream Chip's chief executive, Jens Benndorf, said he is highly excited to join Tessolve and looks forward to building on the strengths of digital design at Dream Chip to combine it with the more established semiconductor services and the post-silicon capabilities of Tessolve, ultimately enabling innovative chip solutions, especially in AI and camera-based applications, for automotive and enterprise markets.